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Carsem (M) Sdn Bhd

 
The semiconductor assembly and test businesses are undertaken by the Carsem Companies, Carsem (M) Sdn Bhd and Carsem Semiconductor (Suzhou) Co., Ltd. The current combined operations of the Carsem Companies (Carsem) make them one of the six largest independent semiconductor sub-contract assembly houses in the world, producing over 100 million units per week and more than 65% of this volume is shipped as fully tested product. Carsem is recognised as a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest range package & test portfolios in the world.

Carsem's end-market is relatively more diversified due to Carsem's wide range of IC packages. Packages cover the widest package range in the industry from a simple low pin count micro device to the more advanced high pin count and high value packages. Carsem also provide a full range of turnkey test services for RF, mixed-signal, analog, digital and power devices. The flexibility in production allows Carsem to supply to different market sectors, such as the industrial, telecommunications, information technology, consumer and automotive thus avoiding over-dependence on any particular sector. Carsem also provides full final test services, supported by extensive R&D and failure analysis laboratories.
Product Groups manufactured include: -

MLP (Micro Leadframe Package)
SiP (System in Package )
ARRAY (wide selection of SSBGA (Small Scale Ball Grid Array) packages using Organic, Flex-Tape and Ceramic substrates in both Ball Grid and Land Grid formats)
FCOLTM (Flip Chip on Leadframe) - Patent Pending
MICRO (variety of lower lead count industry standard packages for the manufacturers of Micro IC's and components)
POWER (surface mountable and thermally enhanced packages for power management IC's and power devices)
SOP (Small Outline Package)
QFP (Quad Flat Package)
PDIP (Plastic Dual-In-Line Package)
PLCC (Plastic Leaded Chip Carrier)
Carsem (M) is situated at Jalan Lapangan Terbang, Ipoh, Malaysia (called "m-site") and Taman Meru Industrial Estate, Jelapang, Malaysia (called "s-site"). Both plants are located at the state of Perak and are approximately 16km apart. In total, Carsem (M) employ more than 9,000 people. M-site is predominantly involved in the production of micro and power packages while the s-site plant produces the higher I/Os thin fine pitch packages and also high-end test services. Both factories maintain world-class quality standards having achieved ISO/TS 16949, SAC Level , ISO 9001, ISO-14001, QS-9000 certifications.
Carsem Semiconductor (Suzhou) Co., Ltd, is located in the province of Jiangsu, 50 miles (80Km) west of Shanghai. The new factory is 172K sq. ft. (16K sq. m.) and is on 430K sq. ft. (40K sq. m.) of land in the Suzhou Industrial Park. The construction started April 2003 and was completed in January 2004. The initial staff has been through extensive training in Carsem's existing Malaysian factories and the assembly and test equipment to support the manufacture of the MLP (Micro Leadframe Pacakge) Quad and Dual will be installed during the second quarter of 2004. Initial customer qualifications were completed the end of the June 2004 and the factory began shipping production volumes in July 2004.


Carsem are supported with a global network of sales and technical support offices. It has marketing offices in Los Angeles, Boston, Dallas and Silicon Valley in the United States and in the United Kingdom (covering marketing operations in Europe) to meet the demands of international customers for more local support and services. The functions of the overseas offices include customer services and technical support as well as sales and marketing.

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